ENGINEERING TOMORROWDirect-contact control
Apply thermal control at the DUT interface for IC characterization, electrical performance tests and failure analysis.
MxThermal / Series: Nine / ENGINEERED BY MXPACThermal test systems.
Thermal test systems.
Control at the device.
Meet Mx-03K from MxThermal (Series: Nine), engineered by MXPAC in Penang, Malaysia: a direct-contact thermal test system for semiconductor characterization, performance testing and failure analysis.
THERMAL SOLUTIONSFrom the test interface
to system integration.
to system integration.
Socket-mounted or PCB-soldered devices. Configurable contact heads. Connected test workflows.
01 / MxThermal Series: Nine
Mx-03K
Localized thermal transfer regulates the case or junction temperature of the device under test, limiting thermal exposure of surrounding circuitry.
TEMPERATURE RANGE−70°C to +200°C
CONTROL ACCURACY±1°C
COOLING CAPACITY AT 0°C3000 W
02 / BUILT AROUND YOUR DUTOne thermal platform.
One thermal platform.
Different test interfaces.
Contact heads and fixtures can be customized for different semiconductor packages, device dimensions and power levels, for both socketed and PCB-mounted configurations.
View technical specifications ↓Touchscreen or programmed operation
Use the 7-inch TFT touchscreen for manual control, or integrate programmed operation through the specified communication interfaces.
Low-temperature test preparation
Clean, dry air or nitrogen suppresses condensation and frost. Match the facility supply to the specified dew point, flow and pressure.
03 / APPLICATION EXAMPLES01 / LABORATORY 02 / ATE & SLT 03 / OEM INTEGRATION
Where MxThermal fits.
Three ways to connect localized thermal control with the test process.
Device characterization
Deploy at the laboratory bench with a device fixture and electrical measurement setup.
WORKFLOWMount the DUT → establish thermal contact → reach the setpoint → measure device performance.
Temperature-conditioned testing
Integrate with automated test equipment or a system-level test platform using a suitable socket or PCB interface.
WORKFLOWPosition the device → condition the DUT → coordinate the test sequence → record results.
A custom test station
Combine the thermal control unit with a customized contact head, fixture and host control interface.
WORKFLOWDefine the package and load → design the interface → integrate controls → validate the test cycle.
Illustrative deployment workflows. Final contact interface, thermal load and test sequence are defined for the application.
04 / TECHNICAL SPECIFICATIONSThe details for
The details for
your test setup.
Mx-03K specifications from the supplied MxThermal product datasheet.
Download full datasheet (PDF) ↗Thermal performance
| Temperature range | −70°C to +200°C |
|---|---|
| Typical temperature transition time | 25°C to −40°C in ≤2 min |
| Temperature control accuracy | ±1°C |
| Display accuracy | ±0.1°C |
| Cooling capacity | Thermal head: 3000 W at 0°C |
| Thermal head dimensions | 55 × 55 mm |
| Temperature sensors | Main probe: TC; DUT: TC; optional: RTD |
Control & connectivity
| Operator interface | 7-inch high-definition TFT color touchscreen |
|---|---|
| Interface languages | Chinese / English |
| Operating modes | Manual control or programmed operation |
| Communication interfaces | RS-232, LAN; optional: GPIB; remote control via Python |
Installation & operating environment
| Refrigerant | Environmentally friendly refrigerant |
|---|---|
| Air hose length | 3 m |
| Purge gas requirements | Clean air or nitrogen, free of oil, moisture and particles; pressure dew point: ≤−70°C (−94°F); 0.1–0.5 SCFM / 0.2 MPa |
| Main unit dimensions | 830 × 850 × 1150 mm (L × D × H) |
| Main unit weight | 300 kg |
| Noise level | ≤59 dBA average |
| Power supply | 410 VAC / 50 Hz, 3-phase |
| Ambient temperature | +0°C to +28°C |
| Relative humidity | 5% to 85% |
Specifications are subject to change without notice as part of continuous product improvement. The stated 3000 W cooling capacity applies at 0°C; the transition time is a typical datasheet value.
05 / ACCESSORIES & CUSTOMIZATIONConnect the system
Connect the system
to your device.
Configure the thermal and mechanical interface around the package, board and test arrangement.
Contact heads & interfaces
Secondary cooling heads, custom socket connection interfaces, and adaptor design and fabrication.
Support & positioning
Height-adjustable support fixtures and customized thermal interfaces for the DUT arrangement.
Fixture options
A pneumatic cylinder fixture (350 kgf) is listed in the datasheet. Select the fixture configuration to suit the application.
Plan the installation together.
Share the device package, target temperatures, thermal load and test interface. We will review the contact head, fixture, electrical supply and dry-gas requirements with your team.
DISCUSS YOUR THERMAL TESTStart with the device.
Start with the device.
Define the right setup.
Tell us about your DUT, temperature profile and test platform.
Enquire about Mx-03K ↗Download the datasheet ↓